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Support 2 * DDR4 Intel 13 CPU Mini PC GM3
Mini PC&Mini host

Support 2 * DDR4 Intel 13 CPU Mini PC GM3

Processor specifications

CPU:

Intel i7-1270P / i7-1280P 1340P 1360P ect.
TDP: 28W
Intel i7-12700H / i7-12900H 13700H 13900H ect. TDP: 45W

CPU terrace:

Intel 12 Generation of 13TH  CPU

Video card:

Intel® Iris® Xe Graphics Support for 4-display

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Product Detailed Specification

Processor specifications

CPU:

Intel i7-1270P / i7-1280-P 1340P 1360P ect. TDP: 28W Intel i7-12700H / i7-12900H 13700H 13900H ect. TDP: 45W

Internal storage

Memory type:

DDR 4  2133 MHz / 2400 MHz / 2666 MHz / 3200 MHZ or 2 * DDR5 4800Mhz / 5200 Mhz

CPU terrace:

Intel 12 Generation of 13TH  CPU

Memory slot:

2*DDR4 S0-DIMM up to 64GB or 2*DDR5 S0-DIMM up to 96GB

Video card:

Intel® Iris® Xe Graphics Support for 4-display

Front panel

Boot button:

1*Power Button

Back panel

Power port:

1*DC Jack 5.5*2.5mm(12-19V)

Thunder and lightning:

1*Thunder bolt4 (compatible with PD power supply)

Network interface:

2*RJ45   2500M

USB joggle:

4*USB3.2 Gen1

Displays the interface:

2*HDMI 0ut 2.04K 60HZ 1*DP 1.4 1*Type-C Thunderbolt 4

Audio interface:

1*3.5mm earphone / 1*3.5mm MIC in

USB joggle:

2*USB2.0

Extended slot

WiFi slot:

1*M. 2 2230 slot (WIFI / BT support) WiFi:802.11 b / g / n / AC / AX Bluetooth 4.0 or above

Other parameters

Appearance size:

174X128X45mm

SSD slot:

1*M. 2 2280 slot (SATA / NVME Gen3 X4 support) 1*M. 2 2280 slot (NVME PCIE GEN4 X4)

Ontology weight:

About 500g

HDD:

1*SATA HDD 2.5inch (optional)

Power adapter:

12V-19V 90W

BIOS support:

AMI UEFI BI0S, Support for PXE, WOL

Work environment

Temperature: 0~50℃ Humidity: 5%~95%

Storage environment

Temperature: -20~70℃ Humidity: 5%~95%

Intel 12/13th generation heterogeneous design

1. Intel 12/13th generation heterogeneous design: Reconstructing the performance ceiling of mini PC

Equipped with Intel i7-13700H to i9-13900H processors (14 cores and 20 threads, 45W TDP), Intel Thread Director technology intelligently schedules performance cores and energy efficiency cores, and multi-tasking efficiency is 71% higher than traditional mini PCs.

Energy efficiency revolution:

Dynamic TDP adjustment (28W-65W), Blender rendering power consumption fluctuation <8%.

Liquid metal heat conduction + carbon fiber air duct design, continuous load surface temperature ≤41℃ (noise 28dBA).

Scene test:

8K video real-time color grading (DaVinci Resolve).

Industrial simulation calculation (MATLAB speed increased by 55%).

2. Four-protocol Thunderbolt 4: cross-border connection hub for mini pc

Technological breakthrough:

Single interface supports 40Gbps data transmission/8K@60Hz output/100W PD power supply.

Compatible with external GPU docking station (RTX 6000 Ada) and PCIe capture card.

Scene adaptation:

Scientific research instrument control (real-time analysis of mass spectrometer data stream).

Esports live streaming (4-way 4K picture synchronous acquisition).
Support 2  DDR4 Intel 13 CPU Mini PC GM3 (1)

3. Dual-mode memory architecture: DDR4/DDR5 free switching.

The world's first mini pc that supports DDR4-3200 and DDR5-5200 dual protocols PC:

96GB DDR5 memory bandwidth reaches 83GB/s, 3D modeling cache efficiency is improved by 40%.

DDR4 mode is compatible with old devices for smooth upgrade.

Enterprise-level features:

ECC memory check (optional), financial transaction error rate is zero.

Asymmetric memory configuration support (32GB+64GB mixed insertion).

4. Dual PCIe 4.0 SSD+anti-vibration HDD: data torrent solution

Storage matrix:

PCIe 4.0x4 SSD sequential read and write 7,400/6,500MB/s (2.3 times faster than the previous generation mini PC).

2.5-inch HDD equipped with a three-dimensional shock-absorbing frame (impact resistance 50

Scenario adaptation:

8-way 4K surveillance storage (RAID 5 mode support).

Mobile surveying and mapping data cold backup (direct reading in -20℃ environment).
Support 2  DDR4 Intel 13 CPU Mini PC GM3 (2)

Industry scenario solutions

1. Smart factory digital twin

Four-screen output (production line monitoring + 3D model + data dashboard + control terminal).
Dual 2.5G network ports to achieve physical isolation of OT/IT networks.

2. Portable medical imaging station

Thunderbolt 4 directly connected to CT angiography equipment (DICOM 3.0 standard).
Antibacterial coating shell (optional) + medical electromagnetic compatibility certification.

3. Edge AI inference gateway

Support OpenVINO toolkit, 16-channel video stream real-time analysis.
M.2 expansion 5G module, latency <15ms.

OEM/ODM customization service

Hardware deep transformation:

Optional CAN bus/GPIO industrial control board.
Customized cooling solution (-40℃~85℃ wide temperature operation).

Enterprise-level management suite:

Intel vPro remote maintenance + TPM 2.0 encryption.
Dual BIOS protection + firmware signature verification.

Strict certification guarantee:

IEC 61000-6-2 industrial electromagnetic compatibility certification.
MIL-STD-810H military specification dust and shock resistance.
  • What is your customized MOQ?

    We do not have any requirements for the number of customizations, but the number of customizations will affect the price. I hope you can understand this.
  • How long is your delivery time?

    If you choose our regular prototype, our delivery time is 7 days if there is no shortage of materials. If you are customizing, you need to check the delivery time according to the actual situation, because there are many uncertain factors. We are generally 30% faster than the industry.
  • What is your after-sales service like?

    For quality problems not caused by human factors within one year, we will bear all the maintenance costs.
  • Assuming that we have industrial or educational needs, will you provide a one-stop solution?

    Yes, we have experience in this area. You just need to tell us your needs, and we have 20 years of engineers to make a plan for you. You can also make a sample first, confirm that there is no problem, and then place a wholesale order.
  • What payment methods do you support?

    We support common payment methods. You still need to communicate with the business for details. Try not to pay on a third-party platform, because that will cause too many deductions, which will increase customer expenses.

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